Andritz to exhibit at Techtextil India, with special focus on air-through bond, needlepunch, biodegradable wipes materials

GRAZ, Austria, November 22, 2021-

International technology group ANDRITZ will present its innovative nonwovens and textile technologies at the booth of its Indian representative PRN Techtex at Techtextil India 2021 in Mumbai, India, from November 25 to 27, 2021 (Hall 7, at DN Associates’ booth A02). A special focus will lie on its technologies for air-through bonding, needlepunch, textile recycling, and processes for biodegradable wipes, like spunlace and WetlaceTM.

Andritz air-through-bonding technology - a reliable solution for the hygiene market

Not a subscriber?

TRY Nonwovens Markets
Newsletter TODAY!